Picosun Oy, leading supplier of high end Atomic Layer Deposition (ALD) thin film coating solutions for global industries, launches ALD equipment for production of high efficiency 3D-integrated trench capacitors.
Capacitors are core components of every electronic device. As the trend is towards constantly miniaturizing and more and more integrated electronic modules, there is a need to develop completely new, disruptive technologies to outperform the existing solutions - especially in areas where flawless performance, long lifetime, and unfaltering reliability are required, such as in medical, space, and aviation applications. 3D-nanofabricated microelectronic components answer this challenge. In high density and high voltage 3D trench capacitors, deep trench structures coated with ultra-thin high-k oxide and metallic layers enable superior voltage and charge density properties.
Picosun's ALD technology is well-established in production of high quality dielectrics for various microelectronic industry applications. Now, PICOSUN™ batch ALD tools optimized for the novel capacitor technology have been proven to reduce cost-of-ownership and deliver excellent uniformity and step coverage for high-k dielectrics into 3D structures.
"Industrialization of the new capacitor technology requires fast and fully automated batch ALD systems. PICOSUN™ batch ALD tools specifically designed for this purpose create an important competitive edge to our company. The ability to provide complete, turn-key solutions for cost-efficient manufacturing of the key components for the most advanced IC devices makes Picosun the choice of leading electronics manufacturers", summarizes Juhana Kostamo, Managing Director of Picosun.
www.picosun.com
