BOBST has confirmed its involvement with Converters Expo on April 26–27, 2022, in Green Bay, WI. The company will use the event to showcase its expertise in coating and laminating technology, with a special focus on new mono-material sustainable substrates.
A new venture for BOBST, Converters Expo is an event where manufacturers for the paper, film, plastic, and nonwovens industries come to introduce the latest technologies for printing and packaging converters. The Expo, which is in its 15th edition, will kick off on Tuesday, April 26, with a welcome reception in the Green Bay Packers Hall of Fame. The show then opens the following day at 8:00 am.
Visitors to the BOBST booth at Lambeau Field will be able to join the conversation around innovation and sustainable solutions for the flexible packaging market and learn about BOBST innovations in lamination, coating and metalizing, including the oneBARRIER product family.
“Converters Expo is brilliantly placed in the heartland of packaging in the Green Bay to Chicago area. It will give BOBST a great opportunity to connect with converters which are interested in finding more sustainable production methods,” said Emilio Corti, Regional Market Director, Americas.
In its search for new solutions that are more environmentally friendly, BOBST has developed the oneBARRIER portfolio in cooperation with other leading suppliers to the flexible packaging industry. The aim is to offer highly functional alternatives to the traditional high-barrier, very complex laminated films by using mono-material films that are designed for recycling.
“With global brand owners issuing sustainability commitments that include pledges to minimize plastic use over the next few years, the industry must move away from complex laminated structures that cannot be recycled. By leading innovation in mono-materials, BOBST can offer new high-barrier substrates that fit into the circular economy, while also being fit for purpose,” added Mr Corti.
Visitors can find BOBST at booth #101 where experts will be ready to explain the technology in more detail.
