Survey results to be presented at BACUS 2015; ZEISS announced as new Initiative member

Enables fast, highly repeatable and cost-effective CD metrology for complex mask shapes, including those resulting from Inverse Lithography Technology, to evaluate their impact on the wafer

Fiberglass enforced epoxy thin-film SMD chip fuses with low DCR and high inrush withstanding capability are ideal for portable electronics

Mentor Graphics Corp. (NASDAQ: MENT) today announced TSMC has certified Calibre® nmPlatform for 10nm FinFET V0.9 process. The Mentor® Analog FastSPICE™ circuit verification platform has achieved circuit-level and device-level certification as well, while the Olympus-SoC™ digital design platform is being enhanced to help designers validate and optimize designs more efficiently in TSMC 10nm FinFET. Completion of the remaining certification with 10nm V1.0 process is targeted for Q4, 2015.

Picosun Oy, leading supplier of industrial scale Atomic Layer Deposition (ALD) thin film coating solutions, now offers its customers an extensive range of new precursor sources especially designed for high volume manufacturing.

Newest macro defect inspection tool with configurable 2D and 3D measurements provides superior capability and cost of ownership

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced it will be showcasing how it leverages the TSMC Open Innovation Platform® (OIP) to optimize customer designs and manufacturing efficiency to ensure first-time product success on the 10nm FinFET (10FF) process at TSMC 2015 OIP Ecosystem Forum. The event is being held on September 17, 2015, at the Santa Clara Convention Center.

New High Performance, High Availability, Unified Storage Solution Supporting Nexenta and HGST Technologies Accelerates I/O and Simplifies Integration, Management and Scalability through Advanced SDS and SSD Technologies

IIC Fall 2015 opens today in Shenzhen, the hub for electronics innovation in South China, and will run through to September 3. Targeting electronics engineers, the event features an exhibition and more than 40 technical presentations on the Internet of Things, smart home, smart devices, Bluetooth, automotive electronics and power technologies. Exhibitors and speakers come from leading global companies such as Allegro, Atmel, Infineon, Keysight, Linear, Mouser, R&S and Qualcomm, as well as top Chinese IC companies including DIOO, SG Micro and VeriSilicon.

Mycronic AB (publ), has received yet another order for a mask writer, built on the Prexision platform, replacing an older system for manufacturing of display photomasks. The system, sold to a customer in Asia, is scheduled to be delivered during the second half of 2016.

Qualcomm® Snapdragon™ Smart Protect Supports On-device Behavioral Analysis for High Security and Malware Detection on the Forthcoming Snapdragon 820

Mycronic AB (publ), has received order for an FPS mask writer within the multi-purpose segment from a customer in the US. The system is scheduled for delivery during the third quarter of 2016.