Research and Markets has announced the addition of the "Global Electronic Packaging Market Research Report 2014-2018: Market to Grow at a Staggering CAGR of 46%" report to their offering.
The Global Electronic Packaging market will grow at a CAGR of 46% to 2018
There are several factors driving the growth of the Global Electronic Packaging market, one major driver being the increasing amount of theft and counterfeiting in various end-user markets globally. Technologies such as RFID and EAS help to reduce such problems and are gaining in importance among the manufacturers of various consumer goods.
The rapid investments in R&D activities by vendors and technological advancements in electronic packaging have resulted in a rising number of new innovations in product packaging. From talking pizza boxes to winking wine bottles, from sensor labels to solar bags and light emitting displays with audio, all are classic examples of innovations in this market. These advancements have forced the manufacturers to differentiate their products from others in this highly competitive market, attract consumers, reduce theft and counterfeiting, and build a brand in the market. Also, such innovations act as a major tool for improving product performance, reliability, and functionality in electronic packaging. Hence, manufacturers of various products are investing more in incorporating new packaging ideas for their products, which is impacting and will continue to positively impact the growth of the Global Electronic Packaging market.
Further, the report states that one major challenge hindering the growth of the market is the lack of awareness, which discourages the use of electronics in packaging.
The key vendors dominating this space are
BASF SE
Enfucell Ltd.
MeadWestvaco Corp.
Soligie Inc.
T-Ink Inc.
The other vendors mentioned in the report are
Acreo Swedish ICT
Blue Spark Technologies
Canatu Ltd.
Cap-XX Ltd.
Cymbet Corp.
Excellatron Solid State LLC
Fraunhofer Institute for Electronic Nano Systems
Front Edge Technology Inc.
Holst Centre
Infinite Power Solutions Inc.
Infratab Inc.
Institute of Bioengineering and Nanotechnology
ISORG
Kovio Inc.
Massachusetts Institute of Technology
NEC Corp.
Novalia Ltd.
Plastic Logic Ltd.
PragmatIC Printing Ltd.
Printechnologics GmbH
PST Sensors
Solarmer Energy Inc.
The Universidade Nova de Lisboa
Thin Film Electronics ASA
VTT Technical Research Centre of Finland
Key Topics Covered:
Executive Summary
List of Abbreviations
Scope of the Report
Market Research Methodology
Introduction
Market Landscape
Market Segmentation by Technology
Market Segmentation by Function
Geographical Segmentation
Buying Criteria
Market Growth Drivers
Drivers and their Impact
Market Challenges
Impact of Drivers and Challenges
Market Trends
Trends and their Impact
Vendor Landscape
Key Vendor Analysis
