Precision Micro, a global leader in photochemical etching technology, has announced its first major production order following the expansion of its etching capabilities to manufacture flow plates for renewable energy applications.

SuperLight Photonics, a pioneer in cutting-edge laser technology launches its SLP-0280, leading in ultrashort pulse lengths in a compact form factor.

The SLP-0280 is an ultrafast laser delivering 25 femtosecond pulses with a center wavelength of 1750 nm (+/- 200 nm).

Merck is part of a consortium of over 20 partners in Germany for the digitalization of supply chains in the semiconductor industry

Critical Manufacturing, a subsidiary of ASMPT and the leading provider of Industry 4.0 focused Manufacturing Execution System (MES), will be demonstrating its highly acclaimed MES functionality at SEMICON Europa, 2023.

Opening of new factory is part of the company’s strategy to expand its global capacity for semiconductor manufacturing

$39-million investment is the largest investment the company has made in its semiconductor equipment and services business
Opening of new factory is part of the company’s strategy to expand its global manufacturing capacity and further support the growing presence of key industry players in the state of Arizona
EMD Electronics implements a strategic workforce plan that includes working with key educational institutions and veteran recruitment efforts

The integration of this solution enables the company to gain valuable insights from its data.

SUSS MicroTec, a leading manufacturer of equipment and process solutions for the semiconductor industry, has implemented Qlik Sense with support from BE-terna.

To meet the rapidly growing demand for opto-semiconductor products, Hamamatsu Photonics will construct a new factory building at its main factory site located in Ichino-cho, Higashi-ku, Hamamatsu City in Japan to handle pre-processing steps in the manufacture of opto-semiconductors.

Seiko Epson Corporation (TSE: 6724, "Epson") has expanded its inertial measurement unit1 (IMU) lineup with the development of the M-G370PDG ("M-G370G"), an IMU equipped with a high-performance, six degrees of freedom sensor. The M-G370G will enter volume production in July 2023.

SCREEN SPE Service Co., Ltd. (hereafter referred to as “SESV”), a group company of SCREEN Semiconductor Solutions Co., Ltd., has recently announced the establishment of a new global training center for cutting-edge equipment within the Kumamoto Site (2083-7 Oyatsu, Mashiki-machi, Kamimashiki-gun, Kumamoto Prefecture).

Merck today announced an agreement with the Commonwealth of Pennsylvania to support expansion plans at its semiconductor manufacturing site in Hometown.

Agreement with the Commonwealth of Pennsylvania supports expansion of manufacturing capacities for the semiconductor industry
The roughly € 300 million investment is part of the company’s “Level Up” program aimed at accelerating its innovation footprint and production capacities

SCREEN PE Solutions Co., Ltd. (SCREEN PE) has finalized development of its Ledia 7F-L Direct Imaging System. SCREEN PE has created the new model to support high-precision pattern formation on large-size substrates and metal masks as they see growing demand for, particularly, telecommunications and IoT infrastructure applications. The Ledia 7F-L is scheduled for release in April.

Model with Exposure Wavelength of 375 nm to Launch in July

SCREEN Holdings Co., Ltd. has finalized development of a new model with a resolution of 2 μm for its lineup of LeVina direct imaging systems for next-generation patterning. SCREEN has created its LeVina range specifically to handle IC package substrates and FOPLP,1 which continue to see growing demand, particularly for 5G, post-5G and IoT infrastructure applications. The new model is scheduled for release in July.