• This certification is a recognition of Ficosa's innovation in the automotive sector and a demonstration of the maturity of solutions such as its CarCom platform.
• The company was also a pioneer in testing the C-V2X technology in the US intelligent cities largest pilot program.

Epson acceleration sensing technology helps realize safer social infrastructure

Toshiba Memory Corporation, the world leader in memory solutions, has started sampling[1] the industry’s first[2] Universal Flash Storage (UFS) Ver. 3.0[3] embedded flash memory devices. The new line-up utilizes the company’s cutting-edge, 96-layer BiCS FLASH™ 3D flash memory and is available in three capacities: 128GB, 256GB and 512GB[4]. With high-speed read/write performance and low power consumption, the new devices are suitable for applications such as mobile devices, smartphones, tablets, and augmented/virtual reality systems.

Live demos will show the latest developments in high-speed system solutions

Thermal Engineering Associates, Inc. (TEA) announces that its industry leading Thermal Test Chip (TTC) will soon be available in 8" (200mm) diameter wafers.

Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, confirms receiving a multiple system order for both high-current and high-energy ion implanters from a major analog customer in Japan with deliveries scheduled in the fourth quarter of 2018 and the first quarter of 2019. Expanding their engagement in the Japan market, Axcelis also plans to showcase their Purion™ Platform of ion implanters in the SEMICON Japan 2018 exhibition. The company will be participating in SEMICON Japan with its distribution and support partner, SCREEN Semiconductor Solutions Co., Ltd., booth #5445 in Hall 5. The SEMICON event, one of the most important technology forums in the Asia Pacific region, is being held December 12-14, at the Tokyo Big Sight in Tokyo, Japan.

Patented Sensor Technology Now Available for Industrial Vision Applications

• TSMC and Synopsys Collaboration Delivers Design Flow for TSMC's WoW and CoWoS Packaging Technologies
• Synopsys Design Platform enabled for TSMC's WoW direct stacking and CoWoS technologies

Epson acceleration sensing technology helps realize safer social infrastructure

Seiko Epson Corporation (TSE: 6724, "Epson") has developed a new high-performance three-axis accelerometer, the M-A352. Samples will begin shipping at the end of 2018, with volume production scheduled for the spring of 2019.

- New device delivers high-speed communications capability to the automotive environment
oshiba Electronic Devices & Storage Corporation (“Toshiba”) announces the launch of a new analog output IC photocoupler that enables high-speed communications in automotive applications – especially electric vehicles (EV) and hybrid electric vehicles (HEV).

Integration of Calibre and Xpedition Platforms Provides Co-Verification Solution for InFO Design Applications

Picosun Oy, the leading supplier of high quality ALD (Atomic Layer Deposition) thin film coating solutions for industrial production, has revolutionized cost-effective MEMS manufacturing with high throughput PICOPLATFORM™ batch ALD cluster technology.