SCREEN PE Solutions Co., Ltd. (SCREEN PE) has finalized development of its Ledia 7F-L Direct Imaging System. SCREEN PE has created the new model to support high-precision pattern formation on large-size substrates and metal masks as they see growing demand for, particularly, telecommunications and IoT infrastructure applications. The Ledia 7F-L is scheduled for release in April.

Model with Exposure Wavelength of 375 nm to Launch in July

SCREEN Holdings Co., Ltd. has finalized development of a new model with a resolution of 2 μm for its lineup of LeVina direct imaging systems for next-generation patterning. SCREEN has created its LeVina range specifically to handle IC package substrates and FOPLP,1 which continue to see growing demand, particularly for 5G, post-5G and IoT infrastructure applications. The new model is scheduled for release in July.

Merck and Intel Corporation are enabling more sustainable semiconductor manufacturing solutions by funding a new academic research program in Europe.

Collaborative research program to harness and augment state-of-the-art artificial intelligence
Aiming for breakthroughs in more sustainable semiconductor processes and manufacturing technologies

New System Delivers World-leading Productivity and High Processing Performance

SCREEN Semiconductor Solutions Co., Ltd. (SCREEN SPE, president: Masato Goto), a SCREEN Holdings Group company, has finalized development of its new SU-3400 single wafer cleaning system.1 The SU-3400 provides world-leading throughput2 combined with a range of unique cleaning technologies. Sales of the system began in December 2022.

SK-P1501G and SK-P2200G Join E Series Lineup

CREEN Finetech Solutions Co., Ltd. (SCREEN FT) has finalized development of two new coater/dryers for the production of substrates used in flexible displays. The SK-P1501G and SK-P2200G are respectively designed to handle 6th1 and 8th2 generation substrates and will join SCREEN FT’s existing E series3 group of production systems for OLED panels. The company launched both models earlier in December.

Critical Manufacturing to showcase its advanced MES semiconductor capabilities at SEMICON Europa.

At 54% smaller than Epson's SG2520 series SPXOs, this series is ideal for high bandwidth optical modules such as 800G transceivers

Epson acceleration sensing technology contributes to safer civil infrastructure

Seiko Epson Corporation (TSE: 6724, "Epson") has learned that the "Yure Mon Hyper" seismic intensity meter manufactured by Tokyo-based Knowledge Foresight Inc. and equipped with Epson's M-A352 high-performance three-axis accelerometer passed the seismic intensity meter certification testing of the Japan Meteorological Agency (JMA) in early June.

Excellent stability and jitter performance make SG-8201CJA ideal for LiDAR and ADAS electronic control units

Seiko Epson Corporation (TSE: 6724, "Epson") has begun shipping samples of the SG-8201CJA, a new addition to Epson's lineup of crystal oscillators (SPXO) with CMOS output1 for automotive applications. Offering high stability and low jitter2, the SG-8201CJA is a simple packaged SPXOs that typically measures 2.0 mm x 1.6 mm x 0.6 mm.

S1C31D41 provides same usability as its predecessors but with voice pitch conversion and built-in clock with ±1% accuracy

Seiko Epson Corporation (TSE: 6724, "Epson") has begun shipping samples of the 96 KB Flash memory S1C31D41, the latest addition to Epson's series of 32-bit microcontrollers (MCUs) with dedicated sound playback hardware. Epson plans to produce 200,000 units per month.

The recent European Chips Act aims to invest €42 billion of public and private funds to 2030 to radically raise Europe's game in the digital economy by bolstering semiconductor production on the Continent.

New controller supports advanced head-up displays with pitch correction and enhanced display safety features