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Last updateThu, 23 Jun 2022 3pm
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Printed electronics for the mobility transition

In times of upheaval, the automotive and aviation industry is focusing on printed electronics. Under the focus topic of Mobility, LOPEC, the international trade fair and conference for flexible, organic and printed electronics, will showcase innovations for traffic on land and in the air. LOPEC will be held from March 22 to 24, 2022 in the ICM – Internationales Congress Center München at the Messe München Exhibition Center.

The meeting place for printed electronics

LOPEC will take place at the ICM – International Congress Center München—from March 22-24, 2022. In addition to the international trade fair for flexible, organic and printed electronics, the LOPEC Conference is the world leading gathering of the industry It will start on March 22, a day before the trade fair itself, with the Business Conference and the Short Courses. The Technical and the Scientific Conference will then take place on March 23 and 24.

Henkel presents innovative printed electronics solutions for 'Smart Surfaces' at LOPEC 2022

Henkel Adhesive Technologies will present a range of functional material innovations for printed electronics at the LOPEC trade fair on 23 and 24 March in Munich. Under the core theme 'SMART Surfaces', the business sector will highlight its portfolio of solutions for a wide range of applications in diverse markets such as surfaces for industry and automotive, antennas, health and hygiene. In addition to material innovations and numerous demo parts developed together with partners, Henkel Adhesive Technologies will also offer application demonstrations at its stand 508 in Hall B0.

Cicor addresses miniaturization of fine-pitch 3D-MIDs with SABIC LNP THERMOCOMP compounds featuring LDS capability to meet demands of 5G-enabled applications

Cicor Group, a leading manufacturer of printed circuit boards and hybrid circuits, has selected SABIC’s LNP™ THERMOCOMP™ compounds with laser direct structuring (LDS) capability to produce high-end, three-dimensional molded interconnect devices (3D-MIDs).

Clever and smart: Continental project team integrates printed electronics in rubber".

Research project led by Continental project manager Tim Wolfer combines rubber, plastics and electronics at the printing technology centre in Freiburg

Result should be an example for many other applications and enable new business models and services
Freiburg is a suitable location with a large network

No chance for hackers: Secure sensor technology for Continental cables

Project sensIC demonstrates integrated sensor technology based on printed electronics in hose lines for battery electric vehicles

Continental expands portfolio with hybrid electronics combining printed electronics and silicon chips
Project partnership with industrial companies and universities runs until spring 2024
Sensor system in the form of a silicon chip for temperature measurement, a non-clonable safety feature and external tamper protection with particle-based fluorescence identification increases safety in vehicles and sensitive production facilities


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