The 7th LOPEC, the International Exhibition and Conference for Printed Electronics, opens its gates at the Messe München trade fair center in just a few weeks. From March 3–5, companies and research organizations from around the world will demonstrate that printed electronic components are making their way into a number of different sectors.

During a successful Working Group Meeting in Tokyo, the OE-A continued its dialogue with JAPERA, the key Japanese organization. Members from all over the world swapped ideas on the state-of-the-art of organic and printed electronics.

Now accepting proposals for the most highly anticipated printed electronics event of the year

Breakthrough made possible using OKI's FiTT method based on high-precision lamination and high-precision drilling

Mobile devices are increasingly being used for mobile transactions such as electronic payments, as well as for digital tickets and for authentication in physical access control systems in secure areas. Such use involves the exchange of highly sensitive personal data, which makes security a top priority. The Munich-based technology group Giesecke & Devrient (G&D) is now presenting the new SkySIM CX® Hercules for use in these scenarios. The combination of the new chip design and software allows multiple applications to be run simultaneously, securely, and at high speed. The solution has been approved by American Express, MasterCard, the People's Bank of China (PBOC), and Visa, and thus meets the requirements for secure payments. In terms of ticketing and physical access control systems, the product supports the MIFARE, CIPURSE, and Calypso standards.

Continuing its tradition of promoting and recognizing printed circuit board (PCB) design excellence, Mentor Graphics Corporation (NASDAQ: MENT) today announced the winners of its 25th annual PCB Technology Leadership Awards. Started in 1988, this program is the longest running competition of its kind in the electronic design automation (EDA) industry. It recognizes engineers and designers who use innovative methods and design tools to address today's complex PCB systems design challenges and produce industry-leading products.

Cal Poly's innovative new online professional certificate program in Printed Electronics and Functional Imaging features courses that focus working professionals on the emerging fields of functional printing: printed electronics, active and intelligent packaging, and security printing.

Picosun Oy, the leading provider of high quality Atomic Layer Deposition (ALD) equipment and solutions for global industries, launches production scale roll-to-roll ALD system which is especially suitable for printed electronics applications.

2014 Symposium provided premier education for the printed electronics community

Mentor Graphics Corporation (NASDAQ: MENT), the market and technology leader in printed circuit board (PCB) design solutions, today announced its newest offering and key building block in the Xpedition® platform, the Xpedition Systems Designer product for multi-board systems connectivity. The Xpedition Systems Designer product captures the hardware description of multi-board systems, from logical system definition down to the individual PCBs, automating multi-level system design synchronization processes to ensure team collaboration with accuracy and faster design productivity.

Toyo Ink Chemicals Taiwan Co., Ltd. (President and General Manager: Osamu Ohtake) and Toyochem Co., Ltd. (President: Satoru Takashima), announced today that they will be participating in TPCA Show 2014 from October 22 to 24, at the Taipei World Trade Center Nangang Exhibition Hall in Taipei, Taiwan.

Rogers Corporation's (NYSE: ROG) Advanced Circuit Materials Division, a global leader in Microwave Printed Circuit Board (PCB) Materials, recently introduced rolled copper cladding options with its RO3003™, RO3035™ and RO3203™ low dielectric constant laminate materials.