Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing its latest industry-leading optoelectronics and Vishay Electro-Films (EFI) solutions at the 2013 SPIE Photonics West Exhibition, taking place from Feb. 2-7 at the Moscone Center in San Francisco.
In booth 5535, products on display will include a wide range of infrared components, in addition to Vishay EFI custom submounts, high-performance RF capacitors, and wire-bondable products.
At the 2013 SPIE Photonics West Exhibition, highlighted optoelectronics from Vishay will include infrared receivers with best-in-class sensitivity, noise filtering, and transmission range; high-power SurfLight™ surface emitters; devices with optically isolating and protecting control circuitry; LEDs in all colors and packages, including white LED modules; and light, proximity, and transmissive sensors.
Featured submounts at the exhibition will include Vishay EFI's AlN (Aluminum Nitride), BeO (Beryllium Oxide), and Al203 (Aluminum Oxide) ceramic substrates, which offer copper-filled vias, thick copper traces, and laser-machined shapes. For bonding, gold/tin solder features 70/30 to 80/20 compositions and thickness from 2 to 8 microns.
Also on display will be Vishay EFI's RFCS surface-mount thin film RF capacitors for impedance matching circuits, decoupling, DC blocking, and lumped element filters. The devices feature capacitance from 0.2 pF to 27 pF, low DCR, and high Q and SRF. Highlighted wire-bondable products will include resistors with TCR to 25 ppm/°C and power ratings to 1 W; resistor networks with tolerances to 0.05 %; single and binary capacitors; and inductors with inductance from 3 nH to 150 nH.
Presented by SPIE -- the international society for optics and photonics -- the Photonics West Exhibition is the essential photonics and laser event, highlighting the latest products, tools, and applications.
