Visitors to this year’s All4Pack will discover the new Esko S2 cloud-based ecosystem, designed to facilitate and enable partner integration, when Esko showcases its latest innovations in Paris. The company will also reveal its new Job Onboarding solution, as well as demonstrating its new Varnish Inspection Module and the new CDI Crystal XPS Quartz Edition, which combines both hardware and screening innovations to significantly improve flexo printing quality.
In a major evolution in software architecture, Esko S2 is a new multi-tenant cloud-native platform that delivers on a technological reality based on cloud computing, data sharing, and artificial intelligence (AI). Existing Esko products - from ArtPro+, ArtiosCAD, and the award-winning Phoenix through to Cape Pack and Automation Engine - connect to the new platform, giving all stakeholders in the value chain 24/7 real-time access to live data and identical resources, wherever in the world they reside. Moreover, Esko S2 is an open platform supporting connectivity with partners.
“At All4Pack we are taking our customers on a journey to the future of connected cloud-based operations,” said Jan De Roeck, Esko Director of Marketing, Industry Relations & Strategy. “We are presenting this platform in Paris with new tools already available for our customers, who can seamlessly integrate their Esko on-premise applications with the S2 platform. This next-generation solution will see brands and their packaging supply chains achieve new levels of go-to-market speed and efficiency, representing a quantum leap in connected integrated workflows.”
From 4-7 November, visitors to booth D058 in Hall 4 of the Paris Nord Villepinte will also learn about Automation Engine SaaS, which enables users to automate workflows across various printing techniques such as digital, flexo, offset, and more. The company will also be showcasing its latest hardware innovations - the AVT varnish inspection module and new CDI Crystal XPS ‘Quartz Edition’ flexo solution.
“The groundbreaking AVT print inspection module empowers labels converters to inspect and detect defects in varnish coatings during a live label print run,” said Jan. “As an add-on to the Helios system, the Varnish Inspection Module enables viewing and inspection of varnish and coating on various printed substrates simultaneously with print inspection. This unique and patented module detects issues such as varnish misregister, partial and full starvation simultaneously with the existing print defect detection, enabling labels converters to achieve maximum output while reducing waste in their print production process.”
Adding a top-of-the-line edition to the successful family of CDI Crystal XPS plate imaging and exposing solutions, Esko is also underlining its commitment to quality with the new CDI Crystal XPS ‘Quartz Edition’.
“Truly the pinnacle of flexo platemaking, the Quartz Edition combines the upgraded optics of the CDI Crystal with optimized Crystal Screens, introducing 2000 lpi surface structures (Q-Cells,” said Jan. “Providing another major leap forward in flexo plate imaging speed and print quality, it combines the upgraded optics of the CDI Crystal with optimized Crystal Screening software, optimizing final print quality and offering a genuine alternative to gravure.”
Esko is also accelerating the entire go-to-market process from significantly further upstream with its new Job Onboarding innovation. “With Job Onboarding, converter sales and customer service employees gain access to the same professional packaging tools as the prepress department,” added Jan. “This creates a more streamlined and automated process speeding up the very start of the supply chain.
“At All4Pack we will show how with these latest innovations in flexo quality, inspection and our integrated ecosystem, we are empowering businesses to significantly shift gears in workflow automation, harnessing cloud technology and AI to further accelerate speed-to-market with vital integrated color accuracy and consistency as part of the automated process,” said Jan.
“We are looking forward to sharing these innovations in Paris and to demonstrating the power of our collaboration in driving a new level of performance for the global packaging and print industry.”
