Economical manufacturing solution with LPKF StencilLaser G 6080
With the LPKF StencilLaser G 6080, high-precision, high-speed drilling in stainless steel foils is made possible. The minimum achievable hole diameter is 30 μm.
Techpaper Filter Applications Using Metal FoilsLPKF Laser und Electronics AG develops and sells laser systems used in electronics fabrication, the automotive sector, and the production of solar cells. With the G 6080, LPKF offers a StencilLaser that can cut apertures in metal foils. Stencils, which are high-precision stainless steel foils used for printing of solder paste in electronics fabrication, make up the main application area. A new technical paper outlines three different processes used to manufacture typical filter structures.
Factors such as the minimum hole diameter, the cutting and drilling quality, and the optimum performance are discussed in the paper. The StencilLaser can drill foils with thicknesses ranging from 30 μm to 1000 μm. Depending on material thickness and hole diameter, either percussion drilling, single-pulse drilling, or cutting is used. Holes of diameter 30 μm can be produced with these laser processes.
The technical paper shows the performance and cutting quality for different cutting parameters, heat affected zones, and process gases.