Technologies on display include comprehensive solutions for advanced computational photography and embedded vision, Bluetooth and Wi-Fi connectivity, low-power audio offloading and 'always-on' voice activation, all optimized for power, cost and performance
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it will showcase a range of comprehensive platform IP solutions at CES 2014 designed to enable the next technology trends in the mobile, digital home and automotive markets. At the show, taking place in Las Vegas from January 7-10(th), CEVA will host a private meeting suite in the Las Vegas Hotel where invitees can interact with the demonstrations and meet with CEVA engineers, partners and members of the executive team.
CEVA's platform IP solutions allow customers to simplify their SoC design effort and significantly reduce both the power consumption and cost of implementing the most advanced technology requirements across a broad range of end markets. These solutions include:
-- The industry's most advanced and lowest power computational photography
and embedded vision platform IP designed to enable true product
differentiation to any camera-enabled device, including all-in-focus
imaging, smart zoom, multi-exposure, object recognition, gesture
recognition, image stabilization and much more.
-- The industry's first universal communications platform IP, addressing
LTE, LTE-Advanced, Wi-Fi, satellite communications, DTV demodulation,
wired access and much more. The platform is scalable to meet any design
requirements, from the Internet of Things (IoT) through smartphones and
tablets to Wi-Fi access points and base stations.
-- The industry's lowest power platform IP for advanced voice and audio
applications, offering extended battery life and enhanced feature sets
such as always-listening voice trigger, noise reduction, speaker
protection, and high-resolution audio.
