According to a new market report published by Transparency Market Research "Photonic IC Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2013 - 2019," the market was valued at USD 160.1 million in 2012, which is expected to reach USD 996.2 million by 2019, growing at a CAGR of 31.3% from 2013 to 2019.
Cost reduction achieved by integrating different optical components such as lasers, detectors, modulators and others into a single unique package is the major driving force for the growth of photonic integrated circuits (PIC) market.
Growing application areas, especially in the field of optical communication, sensing and biophotonics coupled with improvements offered in power consumption, reliability and data transfer speed have further fueled the growth of this market. The advancements in computation power and image processing capabilities are expected to have positive impact on the growth of PIC based products in biophotonics applications. The use of photons for the purpose of computation, offering high-speed data processing and data transfer and data provides a sound opportunity for the growth of PIC market.
In 2012, hybrid integration was the major integration technology used in PICs, accounting for 56.3% of the global PIC market. Although hybrid integration is expected to remain the dominant integration technology, monolithic integration is expected to grow at the fastest CAGR of 36.3% from 2013 to 2019. This can be attributed to the improvements offered in reliability, space reduction, power efficiency, and stabilization processes. On the other hand, the share for module integration is expected to decrease over the forecast period owing to its inferior integration capabilities as compared to other integration technologies.
Indium Phosphide and Silicon-on-Insulator are preferred raw materials used in PICs, collectively accounted for two-third of the total revenue generated in 2012. Indium Phosphide has the ability to integrate both optical and passive functions and components. In addition, InP allows cost-effective mass production using advanced high-yield semiconductor manufacturing processes. Silicon substrates, offering ease in fabrication, and relatively low manufacturing cost are also widely used in PICs.
In terms of applications, optical communications held the highest market share, and was valued at USD 100.9 million in 2012. It is expect to maintain its dominance over the forecast period, growing at a CAGR of 32.9%. This is attributed to growing demand for high-speed communication and rise in data center and WAN applications. In 2012, sensing and biophotonics were the other major application segments, collectively accounting for around 33% of the global PIC market. Optical signal processing application is expected to increase significantly after the commercialization of photonic computing.
North America was the market leader in 2012, followed by Europe and Asia Pacific. Asia Pacific is expected to grow at a CAGR of 35.2% from 2013 to 2019. Increasing number of manufacturing facilities coupled with significant growth in data center applications is expected to fuel the growth in Asia Pacific. The global PIC market is highly fragmented and competitive. Major industry participants include Infinera Corporation (U.S.), Huawei Technologies Co. Ltd (China), Alcatel-Lucent (France), Avago Technologies (Singapore), JDS Uniphase Corporation (U.S.), Finisar Corporation (U.S.), and Intel Corporation (U.S.) among others.
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