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24 Italian companies will be participating as a collective at Pack Expo International in Chicago

North America's biggest packaging show will be back from 23 to 26 October.

The Italian Networking Night will be held on 24 October

Pack Expo International, North America's biggest exhibition for the packaging and processing industry, will be back in Chicago from 23 to 26 October after a four-year break. Ucima is finalising the organisational details of the Italian participation, consisting of a large group of companies ready to demonstrate the finest Italian technology to the US market and to buyers from around the world.
Thanks to the support of the Italian Trade Agency ITA, Ucima will be present at the show with two institutional stands and an Italian pavilion consisting of 24 companies alongside the approximately 70 that are taking part independently.
The 24 companies exhibiting in the Italian pavilion are Altech, Axtra, Bonfiglioli Engineering, Cepi, Easysnap, Gasparin Brevetti, Fabbri Group, Geo Project Industries, Gorreri, Gualapack, Ilpra, Imeta, Lawer, LM, Minipan, Mp Elettronica, Pozzi Packaging, Rejves Machinery, Ricciarelli, Stalam, Technowrapp, Tropical Food Machinery, TT Italy and Vetromeccanica.
"Everyone is looking forward to being back at Pack Expo," says Ucima Chairman Riccardo Cavanna. "This prestigious international showcase is a unique opportunity to take stock of the North American market, a region that accounted for 16% of our export turnover in 2021, a 13% increase over the previous year. We're ready to reconnect with existing customers and form new relationships, and after 4 years are returning to North America with our new digital applications and servitization systems."
In cooperation with the Italian Trade Agency ITA, UCIMA is also organising the Italian Networking Night which will be held on the evening of Monday 24 October at the Chicago Athletic Association Hotel. UCIMA Chairman Riccardo Cavanna and Tom Egan, Vice President of Industry Services for PMMI, the North American Association for Packaging and Processing Technologies which is organising the show, will discuss key issues for the industry at the present time such as sustainability, servitization, IoT and digitalization. The evening will also see the participation of Thomas Botzios, the Italian Consul General in Chicago.
www.ucima.it

 

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